The core principle is to match load-bearing requirements, process conditions, and application scenarios, considering multiple factors:
Load and stress requirements: thicker plates are needed for higher pressure, tension, or impact to avoid deformation or fracture. Extra thickness should be reserved for repeated stress scenarios.
Lamination process parameters: high temperature and pressure affect material stability. Higher pressure or temperature requires increased thickness to maintain rigidity. In multi-layer composites, total thickness must align with lamination accuracy.
Space constraints of the application: installation space limitations require controlling thickness while meeting performance requirements, e.g., in PCB lamination molds or embedded precision machinery components.
Functional requirements: consider thermal conductivity, corrosion resistance, etc. Thinner plates may reduce effective protection in corrosive environments.
Machining and cost balance: thicker plates increase machining difficulty and material cost, while thinner plates may require frequent replacement. Optimize thickness to balance performance and cost.